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Device to cut hard and brittle materials

 “A new, high-tech device that generates intense pressure combined with heat to cut hard and brittle materials has been developed by Western Michigan University researchers and could soon have a huge commercial impact on the machining of difficult-to-machine engineered components. The technological breakthrough, spearheaded by Dr. John Patten, director of the WMU Manufacturing Research Center, and senior research associate and postdoctoral fellow Dr. Deepak Ravindra, uses high pressures generated by diamond cutting tools, along with intense and focused laser beam, to cut hard, brittle objects, such as glass, ceramics, semiconductors, porcelain, stone and much more. The technology could revolutionize the processing and manufacturing of brittle materials, drastically reducing the time and the cost to manufacture everything from complex semiconductors to optical mirrors.” Read more at http://www.wmich.edu/news/2012/05/443

Print posted @ Thursday, June 28, 2012 8:25 AM

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